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Paper Details


Harikrishnan.M*1, Arun Jacob2

Journal Title:Global Journal of Engineering Science and Research Management (GJESRM)

In recent years there has been significant increase in chip level heat fluxes, along with increasing demand for miniaturization. Design engineers are always seeking better methods for packing high-power dissipating electronic equipments .As the power dissipation continue to increase, standard conduction and forced-air convection techniques no longer provide adequate cooling for sophisticated electronic systems This work deals with experimental analysis and numerical analysis of microprocessor cooling using jet impingement. The analysis is done with the help of ANSYS FLUENT 14.0 software Circular orifice of diameter 2mm and 3mm were tested for various Reynolds number, distances between orifice and impinged plate and heat fluxes. Using SST k-w model the effect of jet Reynolds number, target spacing to jet diameter ratio (Z/d) and heat fluxes on average Nusselt number of the target plate are examined. An optimum cooling range is obtained for both 2mm and 3mm nozzle when the Z/d ratio lies between 10and 15. Correlations are proposed for Nusselt number in terms of Reynolds number and it is applicable for air as the jet cooling medium.